PowerUP Asia is a three-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including wide-bandgap (WBG) devices, power semiconductors, and related technologies, as manufacturers worldwide set their sights on power efficiency, carbon reduction, and greener energy.<br><br>
<strong>Track 1: WBG Semiconductors</strong><br>
Adoption of wide band gap (WBG) components—including gallium nitride (GaN) and silicon carbide (SiC)—is gaining traction amid the global trend towards energy conservation, carbon emission reduction, and green sustainability. <br>
The availability of WBG devices are providing new solutions and answers to the challenges that power device designers face in an era in which the watchword is“ efffciency.” <br>
In what applications will WBG semiconductor component play a dominant role? What new circuit architectures using wide bandgap devices will be developed by component suppliers to help power system developers further simplify design complexity and improve overall system efffciency? Find out more in this session.<br><br>
<strong>Track 2: High-Voltage and Low-Voltage Power</strong> <br>
The increasing demand for high voltage devices in various applications is driving developments in power IC technologies. Meanwhile, the proliferation of wireless networks connecting IoT devices are providing opportunities for low-power devices that are powered through energy harvesting. All these developments are presenting new power IC design challenges. This session will look at how designers are creating the next generation of power devices to deliver next-level application performance.<br><br>
<strong>Track 3: Power IC Design/Module and Packaging Technologies, and Renewable Energy</strong><br>
For maximum efffciency, all parts of a power solution must be considered. Packaging is a critical factor that determines the overall efffciency of a power system. This session will look at the latest packaging technologies that help ensure higher power efffciencies and densities.
This session will also discuss the latest trends in alternative energy and how semiconductor devices are supporting the efforts toward developing green energy.
PowerUP Asia 2023Spotlight on Asia's Power Electronics Innovations, Trends, and DevelopmentsVIRTUAL EVENTS MAY 24-26, 2023
In cooperation with
PowerUP Asia 2023
PowerUP Asia is a three-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including wide-bandgap (WBG) devices, power semiconductors, and related technologies, as manufacturers worldwide set their sights on power efficiency, carbon reduction, and greener energy.
Track 1: WBG Semiconductors
Adoption of wide band gap (WBG) components—including gallium nitride (GaN) and silicon carbide (SiC)—is gaining traction amid the global trend towards energy conservation, carbon emission reduction, and green sustainability.
The availability of WBG devices are providing new solutions and answers to the challenges that power device designers face in an era in which the watchword is“ efffciency.”
In what applications will WBG semiconductor component play a dominant role? What new circuit architectures using wide bandgap devices will be developed by component suppliers to help power system developers further simplify design complexity and improve overall system efffciency? Find out more in this session.
Track 2: High-Voltage and Low-Voltage Power
The increasing demand for high voltage devices in various applications is driving developments in power IC technologies. Meanwhile, the proliferation of wireless networks connecting IoT devices are providing opportunities for low-power devices that are powered through energy harvesting. All these developments are presenting new power IC design challenges. This session will look at how designers are creating the next generation of power devices to deliver next-level application performance.
Track 3: Power IC Design/Module and Packaging Technologies, and Renewable Energy
For maximum efffciency, all parts of a power solution must be considered. Packaging is a critical factor that determines the overall efffciency of a power system. This session will look at the latest packaging technologies that help ensure higher power efffciencies and densities. This session will also discuss the latest trends in alternative energy and how semiconductor devices are supporting the efforts toward developing green energy.
Track 1: WBG Semiconductors
Adoption of wide band gap (WBG) components—including gallium nitride (GaN) and silicon carbide (SiC)—is gaining traction amid the global trend towards energy conservation, carbon emission reduction, and green sustainability.
The availability of WBG devices are providing new solutions and answers to the challenges that power device designers face in an era in which the watchword is“ efffciency.”
In what applications will WBG semiconductor component play a dominant role? What new circuit architectures using wide bandgap devices will be developed by component suppliers to help power system developers further simplify design complexity and improve overall system efffciency? Find out more in this session.
Track 2: High-Voltage and Low-Voltage Power
The increasing demand for high voltage devices in various applications is driving developments in power IC technologies. Meanwhile, the proliferation of wireless networks connecting IoT devices are providing opportunities for low-power devices that are powered through energy harvesting. All these developments are presenting new power IC design challenges. This session will look at how designers are creating the next generation of power devices to deliver next-level application performance.
Track 3: Power IC Design/Module and Packaging Technologies, and Renewable Energy
For maximum efffciency, all parts of a power solution must be considered. Packaging is a critical factor that determines the overall efffciency of a power system. This session will look at the latest packaging technologies that help ensure higher power efffciencies and densities. This session will also discuss the latest trends in alternative energy and how semiconductor devices are supporting the efforts toward developing green energy.
Add event to calendar
The conference sessions cover: